Low-pressure, overmolded backshells are now available from API Technologies Corp., Orlando, for connector interfaces on its Electromagnetic Integrated Solutions (EIS) product line.
Ideal for use in military, aerospace, high-end industrial, oil and gas, as well as medical applications, these durable, waterproof and weather resistant backshells offer improved reliability and a simplified specification process. There is no hard tooling required for MIL-DTL-38999 or many other standard connector interfaces and minimal tooling charges for custom configurations.
API’s proprietary overmolding technology offers high strain relief and is designed to withstand high temperatures and harsh environments. The backshell’s molding material electromagnetically shields the cable and offers improved insulation between conductors and the conductor shell.
Its design encapsulates all internal wiring as well as the shield and jacket, ensuring waterproof termination. The mold material penetrates to the connector insert, locking all wires and contacts in place. Contacts will not recess under mechanical stress eliminating the possibility of insulation damage and short circuiting.
These overmolded backshells can reduce cost by approximately 50% compared to standard metal backshells.
API Technologies
eis.apitech.com
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