TE Connectivity (TE) has launched its new ChipConnect internal faceplate-to-processor (IFP) cable assemblies. Designed for Intel Omni-Path Architecture (OPA), TE’s ChipConnect assemblies mate directly with LGA 3647 sockets at the processor and Intel Omni-Path internal faceplate transition (IFT) ports at the faceplate for 25 Gbps speeds. These new cable assemblies reduce system design time and […]
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TE Connectivity’s single wall heat shrink tubing meets the Halogen-free flammability needs
TE Connectivity introduces its new single wall, flame retardant (SWFR) product line. These single wall heat shrink tubing products are rated for the UL VW-1 flammability test specified by the UL 224 standard. Because the highly flame-retardant polyolefin jacket is non-halogenated, SWFR tubing can be used in confined-space applications where it is unacceptable for materials […]
TE Connectivity’s Instalite braid is 50% lighter than copper braid
TE Connectivity (TE), Harrisburg, Pa., announces its new Raychem Instalite lightweight braid system that offers up to 50% weight savings over traditional copper braids. Made from a high-performance, nickel-plated copper alloy, the RoHS-compliant pull-on braid provides better low-frequency performance than plated fibers or microfilaments. Existing low-weight screening solutions are more limited with reduced electrical screen […]